TEC Microsystems - Miniature Thermoelectric Coolers and Sub-Assemblies

1MD03 TE COOLERS KEY FEATURES

◻︎ AdvancedHD TEC assembly technology

◻ Dimensions from 1.0x1.0mm2  to 7.0x7.0mm2

◻ Affordable TE solutions for cooled TOSA apps

◻ Wide range of manufacturing options available

◻ High-quality bulk BiTe material

◻ Accurate steam soldering technology

◻ RoHS compliant TE Coolers by default

◻ Telcordia GR-468 qualified TECs

1MD03 Thermoelectric coolers - ultra-small high-peformance TECs for telecom industry

1MD03

Single-stage

TE Coolers

STANDARD MD03 SERIES 1-STAGE THERMOELECTRIC COOLERS AVAILABLE

Originally MD03 Series was developed as a successor of the MD04 Series, mainly focusing on modern trends in the telecom industry - lower current, higher voltage. Single-stage thermoelectric coolers in the MD03 Series are primarily optimized for telecom applications, especially TO-can TOSA and similar products. MD03 TECs are based on our Advanced HD technology with 400 BiTe pellets per cm2 density. By performance-price factor single-stage thermoelectric coolers from MD03 Series take the golden mean between MD04 and MD02 Series. A reasonable balance between TEC current and voltage, small size and affordable pricing make MD03 thermoelectric coolers optimal for telecom applications with a price pressure factor. The standard and most common single-stage types from our MD03 Series are listed in the table below. All thermoelectric coolers are assembled using RoHS compliant Sn-Sb solder with a melting temperature Tmelt=230ºC. Thermoelectric coolers of MD03 Series all meet Telcordia GR-486 standard requirements. A wide range of TEC manufacturing options is available. Detailed TEC drawings, 3D models, performance plots and estimations for particular application conditions can be provided by request.

THERMOELECTRIC COOLERS 1MD03 SERIES