TEC Microsystems - Miniature Thermoelectric Coolers and Sub-Assemblies

ISO9001:2015 Certified

RoHS


TEC Microsystems GmbH confirms that it only uses qualified component manufacturers in all products, whose specifications meet or exceed the requirements of the European Directive for the Restriction of use of certain Hazardous Substances (RoHS) that were introduced in July 2006, and also include the recast requirements laid down in Directive 2011/65/EC (the EU RoHS 2 directive).

TEC Microsystems GmbH hereby certifies that its products do not contain any of the following banned substances, in quantities which would exceed those specified limits:

◻︎ Lead (Pb) - Limit: 0.10% of component weight = < 1000ppm

◻︎ Mercury (Hg) - Limit: 0.10% of component weight = < 1000ppm

◻︎ Cadmium (Cd) - Limit: 0.01% of component weight = < 100ppm

◻︎ Hexavalent Chromium (Cr6+) - Limit: 0.10% of component weight = < 1000ppm

◻︎ Polybrominated Biphenyls (PBBs) - Limit: 0.10% of component weight = < 1000ppm

◻︎ Polybrominated Diphenyl Ethers (PBDEs) - Limit: 0.10% of component weight = <1000ppm

Every product batch is marked with an internationally recognised RoHS compliancy label, in a prominent position on the products specifications and packaging.

It is the intention of TEC Microsystems GmbH to deal only with suppliers that can demonstrate they can manufacture  products, components or materials in an environmentally responsible manner, that meet the requirements of the RoHS Directive 2011/65/EC.

REACH


TEC Microsystems GmbH fully supports the aim of REACH in improving the protection of human health and the environment through the better and earlier identification of the intrinsic properties of chemical substances. TEC Microsystems products are non-chemical products that are not designed to release any substance under normal and reasonably predictable application scenarios during their lifespan. Therefore, as per REACH requirements, TEC Microsystems GmbH products do not need to be registered.

Based on information obtained from our suppliers, this document certifies that NO TEC Microsystems products contain > 0.1% by weight of the Substances of the Very High Concern (SVHC) as listed by the European Chemical Agency (ECHA) under the provisions of Regulation No. 1907/2006 including the new candidate list that was released on 27th Jun 2018 (191 substances).


Example: 1MC06-142-05 Thermoelectric Cooler Material Composition

Homogenous Parts Name

Trade name

Weight(g)

Homogenous Substance

CAS No.

Weight %

Weight(g)

Ceramic Plates

Alumina

1.12320

Al2O3

1344-28-1

100.00%

1.12320

Bi-Te Pellets

N-type   Bi2Te2.85Se0.15

0.20065

Bi

7787-60-2

52.68%

0.10570

Te

13494-80-9

45.83%

0.09196

Se

7782-49-2

1.49%

0.00299

P-type     Bi0.5Sb1.5Te3

0.20192

Bi

7787-60-2

15.60%

0.03150

Te

13494-80-9

57.10%

0.11530

Sb

7440-36-0

27.30%

0.05513

Terminal  Wires

AWG-28 Blank Single-core Tinned Copper

0.25074

Cu

7440-50-8

98.48%

0.24693

Sn

7440-31-5

1.51%

0.00378

Bi

7787-60-2

0.01%

0.00002

Solder

SnSb

0.02242

Sn

7440-31-5

97.00%

0.02175

Sb

7440-36-0

3.00%

0.00067

Ceramics Plating (Metallization)

Cu

0.12902

Cu

7440-50-8

100.00%

0.12902

Ni

0.02563

Ni

7440-02-0

100.00%

0.02563

Au

0.02223

Au

7440-57-5

100.00%

0.02223


MATERIALS USED FOR THERMOELECTRIC COOLERS MANUFACTURING


Thermoelectric cooler construction is technically pretty simple.  The detailed review is available in our FAQ. Typical thermoelectric cooler, manufactured by bulk technology, consists of ceramics plates with metallization, Bi-Te pellets, terminal wires and assembly solder.  TEC ceramics in most cases is Al2O3 or AlN (or both together in some solutions).  Each Bi-Te pellet pair inside TEC has P- and N- type with slightly different material composition.  Terminal wires in most cases are from Copper, sometimes from Nickel.  TEC internal assembly solder is Sn-Sb Solder 230 (Tmelt=230ºC) by default.  

TEC Microsystems GmbH can provide RoHS and REACH certificate with a detailed material composition for every TE cooler in the manufacturing range.  Below is the example of material composition for 1MC06-142-05 thermoelectric cooler - our standard type from 1MC06 Series.  

All the materials used for our thermoelectric coolers manufacturing are RoHS compliant and fullfil REACH requirements.  All thermoelectric coolers provided by TEC Microsystems are RoHS compliant by default.