TEC Microsystems - Miniature Thermoelectric Coolers and Sub-Assemblies

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TEC Microsystems - Thermoelectric Cooler Manufacturing Options

INTRODUCTION


TEC Microsystems has about 2000 thermoelectric coolers in the standard product range. With all additional options, developed modifications and unique solutions the total number of thermoelectric coolers in the portfolio is more than 5000.  To make the optimal TEC finding easier, we provide our datasheets with a concept "one TEC - one datasheet". There is no grouping or general parametric drawings.  Each datasheet has a detailed and easy-to-read data about exact thermoelectric cooler type. All TEC datasheets have been updated in 2019, the information is actual and up-to-date.


TEC Microsystems TEC datasheet consists of six pages with detailed information about thermoelectric cooler dimensions, standard (default) manufacturing configuration, TEC cooling performance in various modes with related power consumption, TEC construction and additionally available manufacturing options. Below is the example of TEC Microsystems standard TEC datasheet, TEC type 1MDL06-042-09t from 1MDL06 TEC Series.


THERMOELECTRIC COOLER PERFORMANCE PARAMETERS


The thermoelectric cooler datasheet contains information about TEC cooling performance and related TEC current and voltage. TEC parameters dTmax and Qmax are specified for four common ambient conditions mode: +27ºC in Vacuum, +50ºC in Dry N2, +75ºC in Dry N2 and +85ºC in Dry N2. TEC performance is connected to the ambience, and it grows with ambient temperature. By default, TEC dTmax and Qmax values are specified at standard ambient modes. It is essential to understand when you compare TECs from different vendors. TEC Parameters dTmax and Qmax to be compared at the same ambient conditions. If you need to check the performance values in application conditions different from specified in TEC datasheet, you may contact TEC Microsystems and get a quick reply with all necessary information.

TEC Microsystems - Thermoelectric Cooler Performance Plots

THERMOELECTRIC COOLER DESCRIPTION AND KEY FEATURES


The description on the first page of the thermoelectric cooler datasheet contains key info about TEC ceramics material, internal assembly solder, terminal wires, polarity and some extra things related to the standard TEC configuration from the datasheet. At the same time, there is a wide range of additionally available customization options, if required. TEC ceramics material and thickness, internal assembly solder, ceramics surfaces and terminal wires - all can be modified and adjusted following customer requirements. The datasheet shows the standard solution.

In the key features section there is a summary about TEC assembly technology, RoHS compliancy and reliability testing.

THERMOELECTRIC COOLER DIMENSIONS


TEC dimensions and tolerances in TEC Microsystems datasheets are all specified exactly for the selected TEC type with values and tolerances available both in mm and inches. The exterior, proportions and dimensions on each TEC drawing are based on the real thermoelectric cooler as it is. You may entirely rely on TEC shape, dimensions, proportions and exterior as in TEC Microsystems TEC datasheet.  


If required, it's possible to adjust the height of standard thermoelectric cooler using different ceramics thickness without TEC performance or electrical parameters being affected. Please, check our FAQ for more details, Slide #43.

TEC Microsystems - Thermoelectric Cooler Datasheet

Note: the datasheet shows the performance parameters and standard performance plots for TEC in COOLING mode only. The estimations for a heating mode (when TEC operates in a reverse mode) are different and can be provided for particular application conditions by request.

THERMOELECTRIC COOLER MANUFACTURING OPTIONS


TEC Microsystems datasheets show the standard (default) manufacturing configuration and the list of available manufacturing options. By default, most of the thermoelectric coolers are provided with Au plated surfaces (universal for soldering and gluing mounting processes) and blank terminal wires (except TECs with WB configuration by default). The standard list of available TEC manufacturing options is specified in each TEC Microsystems datasheet, page #3. Special manufacturing options and additional value-added services are described in FAQ, slides #53-59 and #80.



DATASHEETS MATERIALS COPYRIGHT


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Thank you for respecting the intellectual property rights protected by the International Copyright laws.

All Images contain TEC Microsystems GmbH hidden watermarks for the immediate proof of their origin.


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There is a simple and quick way to find the optimal thermoelectric cooler for your application. Simply send us the key requirements and get a quick reply with a suggested optimal TEC, detailed  specification and precise estimations of TEC power consumption under your conditions.


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TEC MANUFACTURING OPTIONS


For all our thermoelectric coolers there is range of standard manufacturing options available: ceramics material, surface plating, terminal connection type, protective sealing, thermistor mounting and some other options. Check the quick introduction below to get more info.

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Quick on-line search among standard TEC types available.  Find the optimal type by yourself

Thermoelectric Coolers Datasheets

TEC STANDARD PERFORMANCE PLOTS


TEC Performance Plots are specified for four standard ambient conditions modes. In most cases, thermoelectric coolers vendors use +27ºC (300K) Vacuum and +50ºC (323K) Dry N2 conditions for TEC performance parameters in datasheets. TEC Microsystems datasheets have two additional modes for a more detailed performance overview: +75ºC and +85ºC ambient temperatures in Dry N2 conditions.  


The standard TEC performance plots are shown for five various heatloat levels on TEC, based on percentage from TEC general Qmax value. Heatload level at 0%, 20%, 40%, 60% and 80% from TEC Qmax is specified under each chart. The related dT level curves are marked by color accordingly.