TEC Microsystems - Miniature Thermoelectric Coolers and Sub-Assemblies

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MIN required Cold Side dimensions A x B.  Space to place your object on TEC.

MAX acceptable Hot Side dimensions C x D.  Space available to fit TEC in a package.

MAX acceptable TEC  Height, H. Critical, if you seal TEC in a package with cap.

TEC Hot Side (bottom) temperature.  

Required TEC Cold Side (top) temperature

Ambience (application environmental conditions)

Heatload Q created by object on TEC cold side

Max possible electrical current in operating mode

Max possible electrical voltage in operating mode

The required TEC terminal connection method

TEC Microsystems GmbH has more than 5000 different thermoelectric coolers in the product range. To suggest the optimal thermoelectric cooler (TEC) for your application, we need a proper description of your applicational conditions and requirements.  

Please, fill out the request form below, and our specialists will reply to you quickly with the list of the most optimal TECs.  The most optimal TEC here means it fits your dimensions, fulfills your requirements and has the best coefficient of performance (COP) under conditions as specified.