HD CENTER-HOLE TECs EXAMPLES (TECs with HD Assembly Technology)
CENTER-HOLE TE COOLERS ADVANTAGES
CENTER-HOLE TE COOLERS FEATURES
◻ High-quality bulk BiTe material
◻ Accurate steam soldering technology
◻ RoHS compliant TE Coolers by default
◻ Telcordia GR-468 qualified TECs
◻︎ Easy to integrate in existing "uncooled" design
◻ Advanced HD Technology with higher Qmax
◻ Optimal for LD in TO-46, TO-56, TO-9 headers
◻ Al2O3, AlN and mixed ceramics combinations
Center-hole TECs are optimal for applications with already sealed objects and/or packages with limited space inside. The method of "external cooling" with TEC brings all the advantages of thermal regulation to some traditionally uncooled devices, especially LD in TO-46, TO-59 and TO-9 packages. External thermoelectric cooling allows to reach the superior wavelength stability and increase the performance in cost-effective LD applications. All center-hole TECs are assembled using RoHS compliant Sn-Sb solder with a melting temperature Tmelt=230ºC. Thermoelectric coolers meet Telcordia GR-486 standard requirements. Wide range of TEC manufacturing options is available. The standard and most common center-hole TECs with the advanced HD assembly technology (MD06 Series) are listed in the table below. Detailed TEC drawings, 3D models, performance plots and estimations for particular application conditions are provided by request.
CUSTOMIZED
TECs development
by request
ADVANCED
Center-hole TECs
(HD technology)