TEC Microsystems - Miniature Thermoelectric Coolers and Sub-Assemblies

ISO9001:2015 Certified



Performance @27ºC, Vacuum 

Performance @50ºC, Dry N2 

Cold Side

Hot Side

Height

TEC TYPE

dTmax

Qmax

Imax

Umax

ACR

dTmax

Qmax

Imax

Umax

ACR

A

B

C

D

H


K

W

A

V

Ohm

K

W

A

V

Ohm

mm

mm

mm

mm

mm

1MD06-015-xxH (center-hole 3.4mm dia)

1MD06-015-03H

66

5.5

5.0

1.8

0.28

70

5.9

4.9

2.0

0.31

6.6

6.6

6.6

8.0

1.4

1MD06-015-05H

69

3.5

3.1

1.9

0.45

72

3.8

3.1

2.0

0.50

6.6

6.6

6.6

6.6

1.6

1MD06-015-08H

70

2.3

2.0

1.9

0.70

72

2.5

2.0

2.0

0.79

6.6

6.6

6.6

6.6

1.9

1MD06-015-10H

71

1.8

1.6

1.9

0.88

72

2.0

1.6

2.0

0.98

6.6

6.6

6.6

6.6

2.1

1MD06-015-12H

71

1.5

1.3

1.9

1.05

72

1.7

1.4

2.1

1.17

6.6

6.6

6.6

6.6

2.3

1MD06-015-15H

71

1.2

1.1

1.9

1.30

71

1.4

1.1

2.1

1.46

6.6

6.6

6.6

6.6

2.6

1MD06-032-xxH (center-hole 3.4mm dia)

1MD06-032-03H

65

11.1

4.9

3.9

0.59

70

12.1

4.8

4.3

0.66

8.0

8.0

8.0

9.4

1.4

1MD06-032-05H

68

7.2

3.1

3.9

0.95

72

7.8

3.0

4.3

1.06

8.0

8.0

8.0

8.0

1.6

1MD06-032-08H

70

4.7

2.0

4.0

1.50

74

5.2

2.0

4.4

1.68

8.0

8.0

8.0

8.0

1.9

1MD06-032-10H

71

3.9

1.6

4.0

1.87

74

4.2

1.6

4.4

2.09

8.0

8.0

8.0

8.0

2.1

1MD06-032-12H

71

3.2

1.3

4.0

2.23

74

3.5

1.3

4.4

2.49

8.0

8.0

8.0

8.0

2.3

1MD06-032-15H

71

2.6

1.1

4.0

2.78

74

2.9

1.1

4.4

3.11

8.0

8.0

8.0

8.0

2.6

1MDD06-038-xxH (center-hole 3.4mm dia)

1MDD06-038-03H

65

13.1

4.9

4.6

0.69

70

14.2

4.8

5.0

0.77

8.0

8.0

8.0

9.4

1.4

1MDD06-038-05H

68

8.5

3.0

4.6

1.13

73

9.2

3.0

5.1

1.26

8.0

8.0

8.0

8.0

1.6

1MDD06-038-08H

70

5.6

2.0

4.7

1.78

74

6.1

1.9

5.2

1.98

8.0

8.0

8.0

8.0

1.9

1MDD06-038-10H

71

4.6

1.6

4.7

2.21

75

4.9

1.6

5.2

2.47

8.0

8.0

8.0

8.0

2.1

1MDD06-038-12H

71

3.8

1.3

4.7

2.64

75

4.2

1.3

5.2

2.95

8.0

8.0

8.0

8.0

2.3

1MDD06-038-15H

71

3.1

1.1

4.7

3.29

74

3.4

1.1

5.2

3.68

8.0

8.0

8.0

8.0

2.6

1MD06-130-xxH (center-hole 4.7mm dia)

1MD06-130-03H

68

50.1

5.1

16.1

2.40

73

54.7

5.1

17.7

2.66

14.4

14.4

14.4

16.4

1.4

1MD06-130-05H

70

31.3

3.2

16.2

3.88

75

34.2

3.1

17.8

4.32

14.4

14.4

14.4

16.4

1.6

1MD06-130-08H

71

20.1

2.0

16.2

6.10

76

21.9

2.0

17.9

6.81

14.4

14.4

14.4

16.4

1.9

1MD06-130-10H

72

16.2

1.6

16.2

7.59

76

17.6

1.6

17.8

8.47

14.4

14.4

14.4

16.4

2.1

1MD06-130-12H

72

13.6

1.4

16.2

9.07

76

14.8

1.3

17.9

10.13

14.4

14.4

14.4

16.4

2.3

1MD06-130-15H

72

10.9

1.1

16.2

11.29

76

11.9

1.1

17.9

12.62

14.4

14.4

14.4

16.4

2.6


HD CENTER-HOLE TECs EXAMPLES  (TECs with HD Assembly Technology)

CENTER-HOLE TE COOLERS ADVANTAGES

CENTER-HOLE TE COOLERS  FEATURES

◻ High-quality bulk BiTe material

◻ Accurate steam soldering technology

◻ RoHS compliant TE Coolers by default

◻ Telcordia GR-468 qualified TECs

(placeholder)

◻︎ Easy to integrate in existing "uncooled" design

◻ Advanced HD Technology with higher Qmax

◻ Optimal for LD in TO-46, TO-56, TO-9 headers

◻ Al2O3, AlN and mixed ceramics combinations

Center-hole TECs are optimal for applications with already sealed objects and/or packages with limited space inside.  The method of "external cooling" with TEC brings all the advantages of thermal regulation to some traditionally uncooled devices, especially LD in TO-46, TO-59 and TO-9 packages.  External thermoelectric cooling allows to reach the superior wavelength stability and increase the performance in cost-effective LD applications.  All center-hole TECs are assembled using RoHS compliant Sn-Sb solder with a melting temperature Tmelt=230ºC.  Thermoelectric coolers meet Telcordia GR-486 standard requirements.  Wide range of TEC manufacturing options is available.  The standard and most common center-hole TECs with the advanced HD assembly technology (MD06 Series) are listed in the table below.  Detailed TEC drawings, 3D models, performance plots and estimations for particular application conditions are provided by request.

CUSTOMIZED

TECs development

by request

ROUND TECs

Special TE solutions

with round ceramics

ADVANCED

Center-hole TECs

(HD technology)

REGULAR

Center-hole TECs

(regular technology)