TEC Microsystems - Miniature Thermoelectric Coolers and Sub-Assemblies

STANDARD ML06 SERIES THERMOELECTRIC COOLERS (thin AlN 0.25mm Ceramics)

1ML06 TE COOLERS ADVANTAGES

1ML06 TE COOLERS KEY FEATURES

◻ High-quality bulk BiTe material

◻ Accurate steam soldering technology

◻ RoHS compliant TE Coolers by default

◻ Telcordia GR-468 qualified TECs

1ML06

TECs on AlN

ceramics 0.25mm

◻︎ "Classic" regular assembly technology

◻ Dimensions from 6x6mm2 up to 7.5x17mm2

◻ Elongated TEC shape for DWDM packages

◻ Al2O3, AlN and mixed ceramics combinations

Thermoelectric coolers of ML06 Series are specially developed for telecom applications and industry standard DWDM packages like "Butterfly" 14pin or DIL. ML06 TECs have industry standard dimensions and performace parameters.  ML06 TECs are based on regular pellets placement technology.  Additionally to standard Al2O3 ML06 TECs can be manufactured on AlN ceramics for better temperature uniformity among TEC surface (important in case of direct mounting to TEC cold side without intermediate ceramics bench).  ML06 TECs are assembled using RoHS compliant Sn-Sb solder with a melting temperature Tmelt=230ºC.  Thermoelectric coolers of ML06 Series meet Telcordia GR-486 standard requirements.  Wide range of TEC manufacturing options is available.  The standard and most common ML06 Series TECs on AlN (0.25mm) ceramics are listed in the table below.  Detailed TEC drawings, 3D models, performance plots and estimations for particular application conditions are provided by request.