TEC Microsystems - Miniature Thermoelectric Coolers and Sub-Assemblies

ISO9001:2015 Certified

TO-style headers, TO-46, TO-39, TO-66, TO-8, TO-3 and TO-822

TEC Microsystems GmbH is the official European distributor of Advanced Technology Group company, USA-based manufacturer of high-quality glass-to-metal sealed packages (GTMS), known as well as hybrid packages. TEC Microsystems provides the full range of ATG hybrid and microelectronic packages developed for technology-based industries operating around the world. ATG glass to metal seal products can be found literally from the ocean floor to deep space, with applications in the electronics, aerospace, defence, and communications industries. Common to our customers’ requirements is the need for compact, ultra-efficient design, perfect function and absolute reliability. ATG’s glass to metal seal packages are used in aerospace, automotive, resource exploration, and telecommunications industry.

We invite you to explore our site and learn about over innovative and cost efficient package solutions.

Flatpack packages (FP) - rectangular or square packages with leads parallel to base plane
Dual-in-Line (DIL or DIP) packages - the most common through-hole IC packages.

TO-STYLE HEADERS

FLATPACK STYLE PACKAGES

DUAL-IN-LINE (DIL) PACKAGES

MICROWAVE PACKAGES

Packages that operate at higher frequencies

FIBER OPTICS PACKAGES

◻︎ Wide Range of Standard Products

◻ MIL-883 and MIL PRF 38534 Qualified

◻ RoHS Compliant

◻ ISO 9001:2008 Certified

◻ Quick Development and Customization

◻ CNC Machining services

◻ Made in the U.S.A.

Flatpacks or Dual-in-Line package equipped with a fiber output.

Transistor Outlines (TO) are classic packages that are  being used in many today’s applications. Wide stock of raw material is available with have very quick turnaround times on standard sizes and layouts.

Flatpack packages (FP) - rectangular or square packages with leads parallel to base plane attached on two opposing sides of the package periphery. Widely used for Integrated Circuits (IC) in many industrial applications.

Dual-in-Line (DIL or DIP) packages - the most common through-hole IC packages. Package has two parallel rows of pins extending perpendicularly out of a quad or rectangular metal housing.

Packages that operate at higher frequencies and are available in a wide range of sizes and configurations.

These packages serve the needs of customers from the fiber optic industry. The solutions are based on Flatpacks or Dual-in-Line package equipped with a fiber output. Various configurations are available.

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